The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 1997

Filed:

Mar. 08, 1996
Applicant:
Inventors:

Ryoichi Ochiai, Kawasaki, JP;

Kazunori Miura, Kawasaki, JP;

Seimi Sasaki, Kawasaki, JP;

Goji Nakagawa, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B / ;
U.S. Cl.
CPC ...
385 56 ; 385 60 ; 385 88 ; 385 92 ;
Abstract

An optical link module connection system for connecting an optical fiber to an optical link module that performs conversion between an electrical signal and an optical signal. The system is aimed at reduction of the manufacturing cost of printed circuit boards containing those fiber-optic products by allowing an automated soldering process to be applied thereto. The system will also facilitate the product handling as well as storage and improve the board space utilization by shortening the length of the optical fiber. While optoelectronic conversion means comprises a first ferrule, coupling means consists of a second ferrule, a split sleeve, etc. The first ferrule is inserted into the split sleeve in the coupling means so as to contact the second ferrule, thus completing an optical path between a first optical fiber and a second optical fiber. The optoelectronic conversion means will be soldered to a printed circuit board before being joined to the coupling means. That is, when soldering the printed circuit board, the second optical fiber having only a poor heat resistance is not yet mounted on the board, thus allowing automated soldering equipment to be used for the process.


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