The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 1997

Filed:

Jan. 16, 1996
Applicant:
Inventors:

Thomas J Zamborelli, Colorado Springs, CO (US);

Michael J Steen, Wahpeton, ND (US);

Assignee:

Hewlett-Packard Co., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H / ;
U.S. Cl.
CPC ...
324755 ; 324765 ;
Abstract

A probe adapter providing the capability to test integrated circuit (IC) packages is presented. The probe adapter comprises a mechanical assembly and a probe wire assembly. The mechanical assembly houses the probe wire assembly and facilitates attachment of the probe adapter to the IC under test. The mechanical assembly also ensures correct alignment of the probe wire assembly with the leads of the IC package. The mechanical assembly comprises an alignment member, a guide, a frame and an adapter printed circuit board (PCB). The probe wire assembly comprises a plurality of probe wires, the plurality of probe wires being placed into a plurality of apertures along the perimeter of the guide. One end of the probe wire is placed into electrical contact with a IC package lead, the other end being electrically attached to a tester via the adapter PCB.


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