The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 1997

Filed:

Jun. 07, 1995
Applicant:
Inventors:

Ronald Lamar Freyman, Bethlehem, PA (US);

Craig Joseph Garen, Bethlehem, PA (US);

Clinton Hays Holder, Jr, Slatington, PA (US);

Robert Nelson Kershaw, Harleysville, PA (US);

Edward Clayton Morgan, Macungie, PA (US);

Assignee:

Lucent Technologies Inc., Murray Hill, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257784 ; 2281805 ;
Abstract

A multifunctional chip includes first and second electrically isolated bonding pads. The chip also includes a control circuit coupled to the second bonding pad. The control circuit commands the chip to perform the first function if the first and second bonding pads are coupled. Alternatively, the control circuit commands the chip to perform the second function if the first and second bonding pads remain electrically isolated. The coupling or isolation between the first and second bonding pads is determined by wire bonds. Therefore, the use of wire bonds selects the function for the chip.


Find Patent Forward Citations

Freyman, Ronald. (1997). Multifunctional chip wire bonds (U.S. Patent No. 5646451). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5646451

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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