The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 1997
Filed:
Dec. 28, 1995
Shoji Noda, Aichi-ken, JP;
Kiyoshi Uchida, Toyota, JP;
Akio Itoh, Nagoya, JP;
Kazuo Higuchi, Seto, JP;
Mikio Niimi, Handa, JP;
Shun-ichi Murasaki, Nagoya, JP;
Yoshinobu Honkura, Aichi-ken, JP;
Kabushiki Kaisha Toyota Chuo Kenkyusho, Aichi-ken, JP;
Aichi Steel Works, Ltd., Tokai, JP;
Abstract
A thin film layered member having high heat dissipation efficiency is composed of at least two diamond layers and at least one interlayer. The diamond layers and the interlayer ape alternately laminated and the diamond layers form outer surfaces of the thin film layered member. When this member is applied to a heatsink or the like, thermal stress to an element mounted thereon can be reduced because of a laminated structure comprising an interlayer having a high coefficient of thermal expansion and diamond layers having a low coefficient of thermal expansion. Further, the interlayer includes a carbide forming metal, which reacts with carbon atoms constituting a diamond in a laminating process and to form a carbide at an interface between the interlayer and the diamond layer, thereby realizing strong bonding therebetween.