The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 1997
Filed:
Jul. 18, 1996
Tiang Siong Lian, Singapore, SG;
Advanced Systems Automation PTE, Ltd., Singapore, SG;
Abstract
A method for encapsulating semiconductor devices includes the steps of: providing a molding system and a close-loop control system which is coupled to the molding system, the close-loop control system including a computer, a programmable logic control, a servo motor controller, and at least two drivers, wherein the servo motor controller is coupled to the computer and the programmable logic control, respectively, the servo motor controller is further coupled to the drivers, and the drivers are coupled to the molding system; clamping together at least one set of top and bottom molds of the molding system, the molding system including a clamping assembly having a clamping axis, the close-loop control system being coupled to the clamping assembly; feeding a molding compound into a cavity formed by a space between at least one set of top and bottom molds, the molding system further including a transfer assembly having a transfer axis; alternating a gear switching assembly of the molding system between a high speed mode and a high torque mode along the clamping axis, the gear switching assembly being coupled to the clamping assembly; and providing feedback from the close-loop control system to the clamping assembly and transfer assembly of the molding system to minimize disproportionate drive along the clamping and transfer axes, respectively.