The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 1997
Filed:
Jul. 11, 1996
Toshio Sakamoto, Kanagawa-ken, JP;
Tatsuhiko Inoue, Kanagawa-ken, JP;
Mamoru Yoshida, Kanagawa-ken, JP;
Nippon Unicar Company Limited, Tokyo, JP;
Abstract
A process for preparing an expandable resin composition comprising the following steps: (a) admixing, at a temperature in the range of about 120 to about 130 degrees C., the following components: (i) 100 parts by weight of a high pressure, low density homopolymer of ethylene; (ii) about 30 to about 200 parts by weight of a high density polyethylene having a melting point higher than the above mixing temperature; (iii) about 2 to about 50 parts by weight of polypropylene having a DSC melting point of not less than about 140 degrees C.; and (iv) about 0.1 to about 2 parts by weight of a silane coupling agent; and (b) admixing, at a temperature in the range of about 120 to about 130 degrees C., 100 parts by weight of the mixture produced in step (a) with 0.5 to 3 parts by weight of one or more chemical blowing agents having a decomposition temperature higher than the above mixing temperature.