The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 1997
Filed:
Sep. 27, 1994
Mehrdad Yasrebi, Clackamas, OR (US);
Mark Edwin Springgate, Portland, OR (US);
Douglas Gene Nikolas, Battleground, WA (US);
William Warren Kemp, Milwaukie, OR (US);
David Howard Sturgis, Gladstone, OR (US);
Renee Van Ginhoven, Seattle, WA (US);
Precision Castparts Corporation, Portland, OR (US);
Abstract
Time-stable yttria slurries, and a method for forming such yttria slurries and articles therefrom are described. The method involves forming an intimate mixture comprising yttria and at least about 0.1 weight percent of a dopant material. An aqueous slurry is then formed comprising from about 1 weight percent to about 95 weight percent of the intimate mixture. The intimate mixture may be formed by heating the mixture to a temperature sufficient to calcine the mixture. Alternatively, the intimate mixture may be formed by heating the mixture to a temperature sufficient to fuse the mixture. The dopant also may be provided as a surface coating on the yttria particles. The dopant material comprises an oxide or hydroxide, or combinations thereof, or compounds that form such oxides or hydroxides upon further processing, wherein the metal oxides or hydroxides are of metals selected from the group consisting of aluminum, titanium, niobium, tantalum, silicon, hafnium, tin, gallium, indium, beryllium, thorium, boron, scandium, vanadium, chromium, ruthenium, rhodium, iridium, palladium, platinum, copper, germanium, bismuth, tellurium, erbium, thulium, ytterbium, lutetium, neptunium, plutonium, and combinations thereof. The aqueous suspension may further comprise other materials, such as other ceramic or metallic particles, co-solvents, dispersing agents, surfactants, inorganic binders, or organic binders.