The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 1997
Filed:
Aug. 30, 1995
Applicant:
Inventor:
David Seung-Kyu Lee, Brookfield, WI (US);
Assignee:
General Electric Company, Milwaukee, WI (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228127 ; 228194 ;
Abstract
A method is used to bond dissimilar metals, such as for an x-ray tube. Copper and steel tubular components are provided. An interlayer material situated between the metal layers is used to bond the copper and steel tubular components by solid state diffusion process. The interlayer material may be pure nickel, pure copper, or a layered combination of nickel and copper or copper alloy. The use of the low cost interlayer material and the solid state diffusion process yields a strong bond between the dissimilar metals.