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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5641997 B1

PDFFull Text
Date of Patent:
Jun. 24, 1997

Filed:

Sep. 13, 1994

Plastic-encapsulated semiconductor device

Applicant:
Inventors:

Hideo Ohta, Tokyo, JP;

Tetsuo Okuyama, Yokohama, JP;

Shinetsu Fujieda, Kawasaki, JP;

Sadao Kajiura, Kanagawa-ken, JP;

Akira Yoshizumi, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kanagawa-ken, JP;

Attorney:

Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.

Primary Examiner:

Sara W Crane

Assistant Examiner:

Roy Potter

Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257788 ; 257789 ; 257790 ; 257795 ;
Abstract

A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property.

Find Patent Forward Citations

Ohta, Hideo. (1997). Plastic-encapsulated semiconductor device (U.S. Patent No. 5641997). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5641997

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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