The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 1997
Filed:
Sep. 13, 1994
Applicant:
Inventors:
Hideo Ohta, Tokyo, JP;
Tetsuo Okuyama, Yokohama, JP;
Shinetsu Fujieda, Kawasaki, JP;
Sadao Kajiura, Kanagawa-ken, JP;
Akira Yoshizumi, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kanagawa-ken, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257788 ; 257789 ; 257790 ; 257795 ;
Abstract
A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property.