The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 1997

Filed:

Sep. 07, 1995
Applicant:
Inventors:

Yoshijiro Ushio, Kawasaki, JP;

Tatsuo Niwa, Sakura, JP;

Assignee:

Nikon Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G / ; G03G / ;
U.S. Cl.
CPC ...
430 31 ; 430126 ;
Abstract

A circuit forming method having the step of forming, on an insulating board or a metallic foil layer, a resist pattern layer for patterning the metallic foil layer to be laminated to the board with a predetermined circuit by means of etching or lift-off, wherein the resist pattern layer forming step comprises the steps of forming an electric field distribution latent image corresponding to the circuit pattern by illuminating a predetermined area on a surface of a photoconductor charged beforehand with light for removing the charge of the surface of the photoconductor, forming a resist image corresponding to the circuit pattern by attaching a resist member charged reversely with respect to the latent image to the latent image, and transferring the resist image to the board or the metallic foil layer as the resist pattern layer.


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