The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 1997
Filed:
Oct. 11, 1995
Takeo Yamada, Yokohama, JP;
Kazuo Kawamura, Hachioji, JP;
Hironobu Yoshikawa, Hachioji, JP;
Minoru Moriya, Uenohara-machi, JP;
Toshiyuki Kasahara, Hino, JP;
Nireco Corporation, Tokyo, JP;
Abstract
The invention provides an apparatus for checking glue application state of almost electrically non-conductive object to which an electrically conductive glue is applied on either side thereof, including (a) an electrode for transmitting high frequency therefrom, (b) a pair of receiving electrodes each spaced from the high frequency transmitting electrode at its opposite sides, (c) a detector head for aligning distal ends of the electrodes at almost the same level and shielding the electrodes from one another, (d) a high frequency generator for supplying high frequency to the high frequency transmitting electrode, (e) a gluing condition detector for detecting gluing condition of the object on the basis of a difference in output between the receiving electrodes, and (f) a position adjuster for adjusting relative position between a glue applied to the object and each of the electrodes. Outputs of the receiving electrodes contains almost the same amount of noise, and thus it is possible to eliminate noise by calculating a difference in output between the receiving electrodes. Thus, the present invention ensures more accurate detection of the gluing condition of an object.