The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 1997
Filed:
Feb. 06, 1996
George J Krausse, III, Fort Collins, CO (US);
Directed Energy, Inc., Ft. Collins, CO (US);
Abstract
A packaging system for minimizing thermal-induced stress in a high power semiconductor device. The system is comprised of an electrically insulating, thermally conductive substrate having planar upper and lower surfaces, a semiconductor die having a planar lower heat extraction surface attached to said upper surface of said substrate, and electrically insulating thermal compound disposed between and in contact with the said lower heat extraction surface of said substrate and the system heat extraction upper surface. .DELTA.L.varies..DELTA.S is defined in Equation 12, wherein T.sub.B is the temperature at said outer edge of the lower heat extraction surface of said die, T.sub.D is the temperature at said outer edge of the lower surface of said substrate, and PPM is part per million.