The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 1997
Filed:
Jun. 07, 1995
Steven Joel Diffenderfer, Deposit, NY (US);
Hussain Shaukatullah, Endwell, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of making an electronic package including providing a leadframe of a single layer of material. The leadframe includes a semiconductor device support, a plurality of signal leads, and a common ground portion surrounding the device support portion. A semiconductor device having a plurality of signal sites and a plurality of ground sites is positioned on the semiconductor device support of the leadframe. Selected ones of the signal sites are connected to respective ones of the signal leads. Selective ones of the ground sites are connected to the common ground portion of the leadframe. Each of the signal leads are electrically isolated from each other and from the common ground portion of the leadframe.