The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 1997
Filed:
Mar. 06, 1995
Kohei Tatsumi, Kawasaki, JP;
Hiroyuki Kondo, Kawasaki, JP;
Michio Nitta, Kawasaki, JP;
Shinya Nariki, Kawasaki, JP;
Nippon Steel Corporation, Tokyo, JP;
Abstract
The present invention provides a bonding wire having a good bonding property, no damage sustained to coatings during bonding, and capability of retaining an excellent insulating property even when wires come into impact with one another in the resin molding step, characterized in that the resin has a thermal weight loss at a temperature of 110.degree. C. in air of not less than 85% and an tensile strength at 180.degree. C. of not less than 300 kgf/cm.sup.2. The resins satisfying the specified characteristic conditions can be selected from the group consisting of polyparabanic acid based resins and polyarylate resins.