The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 1997
Filed:
May. 11, 1992
Applicant:
Inventors:
Prem Nath, Rochester Hills, MI (US);
Craig N Vogeli, New Baltimore, MI (US);
Assignee:
United Solar Systems Corporation, Troy, MI (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
438460 ; 148D / ;
Abstract
A method of severing a thin film semiconductor device. The semiconductor device includes a substrate having a first electrode region formed thereon, a semiconductor body formed of layers of thin film semiconductor alloy material disposed upon the base electrode, a transparent, electrically conductive second electrode deposited atop the semiconductor body, and a containment layer of polymeric material associated with the first or second electrode in at least one region to permit subsequent severing of the device into a plurality of devices through said containment layer region.