The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 1997
Filed:
Sep. 28, 1995
Akira Nakayama, Kawasaki, JP;
Toshio Nagase, Kawasaki, JP;
Nippon Zeon Co., Ltd., Tokyo, JP;
Abstract
A process for adhesion using an epoxy rein adhesive composition which comprises coating surfaces for adhesion with a two component epoxy resin adhesive composition prepared immediately before the coating by mixing a mixture containing (A) resin powder prepared by ionic crosslinking of resin particles by addition of a metal cation and (B) an epoxy resin with (C) a curing agent of a room temperature curing type for epoxy resins, bringing the coated surfaces for adhesion into contact with each other, and subsequently heating the surfaces for adhesion. The resin particle is constituted with (a) a core formed with a (meth)acrylate polymer and/or a diene polymer which has a glass transition temperature of -30.degree. C. or lower and (b) a shell formed with a copolymer of a (meth)acrylate monomer and a radical polymerizable unsaturated carboxylic acid monomer having carboxyl group and 3 to 8 carbon atoms which has a glass transition temperature of 70.degree. C. or higher. The adhesive composition used in the process can be cured by heating at a moderate temperature of 40.degree. to 100.degree. C., and a high tensile shear strength and T-peeling strength can be achieved.