The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 1997
Filed:
Nov. 23, 1994
Kotaro Yamamoto, Tokyo, JP;
Norio Yoshikawa, Yokohama, JP;
Masahito Yamaguchi, Tokyo, JP;
Masaaki Habata, Tokyo, JP;
Koji Osafune, Tokyo, JP;
Toshiaki Hattori, Tokyo, JP;
Toshikuni Sato, Kawasaki, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
The dimension ratio t/H of the thickness t of a flexure spring to the height (thickness) H of a slider 17 is set at 0.047 or less in order to reduce the variation in crown amount due to a temperature variation. As the ratio of the thickness t of the flexure spring to the height H of the slider decreases, the stress acting in the slider due to a difference in linear expansion coefficient between itself and the flexure spring decreases and the rigidity of the slider increases relative to the flexure spring. The dimension ratio H/L of the height H of the slider to the length L thereof is set at 0.245 or more. As the dimension ratio H/L increases, the rigidity of the slider increases and the amount of deformation of the slider due to a difference in linear expansion coefficient between itself and the flexure spring decreases. In addition, the ratio A2/A1 of an actual adhesion area A2 between the slider and a slider fixing portion of the flexure spring to a possible adhesion area A1 therebetween is reduced to 0.42 or less. Moreover, a temperature compensation member is adhered to the slider or the flexure spring.