The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 1997

Filed:

Jan. 20, 1995
Applicant:
Inventor:

Michael E Griffin, Maplewood, MN (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ; H05K / ; H05K / ;
U.S. Cl.
CPC ...
361794 ; 174252 ; 174255 ; 174260 ; 174262 ; 257723 ; 257724 ; 361761 ; 361764 ; 361792 ; 361818 ; 361820 ; 361717 ; 361718 ; 361719 ; 361720 ; 361788 ; 361796 ; 361799 ; 361800 ; 361803 ; 439 68 ; 439 83 ; 439 61 ;
Abstract

An electronic circuit structure having a reduced size includes a circuit substrate, an aperture extending through the circuit substrate, and an electronic component suspended within the aperture. The suspension of the electronic component within the aperture significantly reduces the profile of the overall electronic circuit structure. The aperture further enables electronic components to be mounted in a partially overlapping fashion to reduce the surface area of the electronic circuit structure. The electronic circuit structure can make use of standard FR-4, G-10, or ceramic circuit substrates or multilayer flex circuits, as well as electronic components in the form of standard leaded integrated circuit packages. The mounting of the electronic component within the aperture of the circuit substrate provides an advantage of assisting in heat dissipation. The incorporation of mesh-like voltage and ground planes can further aid in heat dissipation and provide electrical isolation and capacitive filtering. In addition, the electronic circuit structure facilitates high density packaging of several electronic structures, for example, in a stacked or radial configuration.


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