The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 1997
Filed:
Oct. 02, 1995
Richard E Heppler, Mesa, AZ (US);
Paul L Sullivan, Phoenix, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A semiconductor device (10) is formed from a single leadframe (11) by aligning two electronic components (22,24) relative to each other. The leadframe (11) has two bonding regions (30,31), which are offset from each other, and interconnect bars (13) which are used to align the two bonding regions (30,31). After the electronic components (22,24) are mounted to their respective bonding regions (30,31), the interconnect bars (13) are bent downward or upward relative to the plane formed by the leadframe (11). The bending of the interconnect bars (13) will move the two electronic components (22,24) towards each other in the direction essentially parallel to the plane of the leadframe (11). A transparent mold (28) is then formed to encapsulate the electronic components (22,24). A body (29) is then formed around the transparent mold (28) and leads (19,20). A trim and form operation releases the semiconductor device (10) from the leadframe (11).