The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 1997
Filed:
Mar. 20, 1995
Stephen R Winzer, Ellicott City, MD (US);
Paul J Caldwell, Baltimore, MD (US);
Natarajan Shankar, Columbia, MD (US);
Tushar K Shah, Sykesville, MD (US);
Keith Bridger, Washington, DC (US);
Andrew P Ritter, Surf Side Beach, SC (US);
Martin Marietta Corp., Bethesda, MD (US);
AVX Corporation, Myrtle Beach, SC (US);
Abstract
An improved transducer array includes a two-dimensional array of multilayer actuators, capable of producing very high displacement with low input voltage, integrally packaged with conditioning electronics. Preferred microcomposite actuators use multiple layers of stacked electrostrictive ceramics and conductive materials. The actuators are aligned in a two-dimensional array and can be integrated with the conditioning electronics in a variety of packaging systems. A preferred packaging system is a flexible high density interconnected multi-chip module which has the integrated circuit chips disposed in a substrate, interconnection layers disposed thereon and the multilayer composite actuators disposed on the surface of the interconnection structure. The actuators in this packaged array may be optionally addressed individually or in blocks, depending on the application intended.