The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 1997
Filed:
Oct. 19, 1993
Sadao Kitagawa, Yokkaichi, JP;
Yuta Kumano, Yokkaichi, JP;
Mitsubishi Petrochemical Co., Ltd., Tokyo, JP;
Abstract
Disclosed is a resin molding comprising a molding composed of a resin composition comprising 100 parts by weight of a substrate resin comprising 100 to 30% by weight of at least one propylene polymer selected from the group consisting of propylene/ethylene block copolymers having an ethylene content of 3 to 45% by weight and propylene/ethylene random copolymers having an ethylene content of 0.5 to 10% by weight and 0 to 70% by weight of an elastomer, and at least one member selected from the group consisting of (A) 0.01 to 10 parts by weight of a 1,3-diene polymer having at least one terminal hydroxyl group or a hydrogenation product thereof, (B) 0.01 to 40 parts by weight of a copolymer of ethylene with an unsaturated compound containing a carboxyl group (including an acid anhydride group) and (C) 0.01 to 40 parts by weight of a copolymer of ethylene with an unsaturated compound containing a hydroxyl group, with the proviso that if at least two members of components (A), (B) and (C) are used in combination, the total amount does not exceed 40 parts by weight, which preferably has a coating formed directly on the surface of said molded body. One preferred application of this coated resin molding is an automotive part, especially a bumper.