The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 1997

Filed:

Nov. 24, 1995
Applicant:
Inventors:

Tien S Chao, Hsinchu, TW;

Chih-Hsun Chu, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438591 ; 257411 ; 438515 ; 438762 ; 438923 ;
Abstract

A process for suppressing boron penetration in BF.sub.2.sup.+ -implanted P.sup.+ -poly-Si gates provides a nitrided layer between the oxide layer and poly-Si through use of inductively-coupled nitrogen plasma (ICNP) to form an energy barrier which the boron ion can hardly penetrate. The process includes the steps of growing an oxide layer by washing the silicon, introducing nitrogen gas into the inductively-coupled plasma (ICP) system and carrying out nitrogen plasma surface treatment at RF power of 150w to 250w; stacking polysilicon of 3000 .ANG. low pressure chemical vapor deposition (LPCVD) system; implanting BF.sub.2.sup.+ at 5.times.10.sup.15 atom/cm.sup.2 and 50 KeV; removing the surface oxide layer by annealing at 900.degree. C. for a time; and plating Al to form a MOS capacitor and measuring electric properties.


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