Inspecting method of an electronic component during a mounting operation

Abstract

An electronic component is inspected before it is mounted onto a substrate. The electronic component has a plurality of lead rows, each lead row including plural leads arrayed in a line along and protruding from a side face of a main body of the electronic component. Positional data of the plural leads, including altitudinal values representing heights of respective leads, are measured. A plurality of approximate lines are obtained on the basis of the positional data, each approximate line approximating each lead row on a side face of the electronic component main body. Any faulty lead, extraordinarily deformed compared with other leads, is detected on the basis of the positional data. A mutual positional relationship is obtained between the approximate lines, and it is judged whether the mutual positional relationship is within a predetermined range. Then, the leads of the electronic component are positioned onto electrodes of the substrate applied solder thereon only when the faulty lead is not detected and the mutual positional relationship is within the predetermined range. Thereafter, the substrate is heated and the solder is melted to provide a permanent rigid connection between the leads and the electrodes.