The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 1997
Filed:
Mar. 13, 1995
Applicant:
Inventors:
Takemori Takayama, Osaka, JP;
Masato Miyake, Osaka, JP;
Yoshitaka Ohyama, Osaka, JP;
Katsuyoshi Saito, Kyoto, JP;
Hiroshi Ono, Saitama, JP;
Assignee:
Kabushiki Kaisha Komatsu Seisakusho, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ; C08K / ; C08K / ;
U.S. Cl.
CPC ...
528338 ; 528310 ; 528322 ; 5283291 ; 528339 ; 528340 ; 528341 ; 524100 ; 524227 ;
Abstract
By the use of a binder comprising (a) 40 to 70 wt % of a water-soluble amide material and/or water-soluble amine material and (b) 25 to 60 wt % of a polyamide resin component substantially composed of a polyamide resin material having 10 carbon atoms or more on average between amido groups, a molded article is produced by metal powder injection molding. From such a molded article, the water-soluble amide material and/or water-soluble amine material is eluted by a water-based solvent and then, the polyamide resin component is removed by heating.