The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 1997
Filed:
Jun. 21, 1995
Andrew A Alibocus, Tomball, TX (US);
John F Haarde, The Woodlands, TX (US);
Troy W Beacleay, Houston, TX (US);
John Hua, Cypress, TX (US);
Mark A Smith, Houston, TX (US);
Compaq Computer Corporation, Houston, TX (US);
Abstract
Glue dots are deposited on a substrate side of a partially completed printed circuit board, between pairs of component mounting pads disposed on the substrate and having quantities of solder paste thereon, using a resilient stencil plate having a spaced series of glue discharge openings extending transversely therethrough, and a spaced series of side recesses. The recess side of stencil plate is positioned in a spaced, parallel and opposing relationship with the mounting pad side of the substrate with the plate recesses being aligned with the substrate mounting pads, and the glue discharge openings being aligned with glue leveling pads disposed on the substrate side between adjacent mounting pad pairs. Glue is deposited on the outer stencil plate side and a squeegee blade is moved along the outer stencil plate side to deflect it toward the substrate and force glue through the discharge openings to deposit glue dots thereon when the stencil plate is permitted to return to its undeflected position. As the plate is deflected, its depressions receive and provide clearance for the mounting pads so as not to disturb the solder paste quantities thereon. Electrical components are then pressed against pairs of mounting pads, and the glue dots therebetween, before being subjected to a final soldering process. In this manner the use of a needle type dispensing machine to deposit the glue dots is advantageously avoided.