The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 1997
Filed:
Dec. 30, 1994
Applicant:
Inventors:
Shoji Yamaguchi, Hyogo-ken, JP;
Akira Yamada, Hyogo-ken, JP;
Yasuo Furuhashi, Hyogo-ken, JP;
Fumiaki Baba, Hyogo-ken, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156537 ; 156598 ;
Abstract
An apparatus for producing a multi-layer printed circuit board. The printed circuit board includes a bottom layer board, a hole board, and an adhesive sheet between the bottom layer board and the hole board. The printed circuit board is heated so that adhesive sheet bonds the bottom layer board to the hole board. A mold release sheet and a thermoplastic resin sheet begins to soften at a temperature lower than the melting temperature of the adhesive. A contraction control member controls contraction when the thermoplastic resin sheet cools.