The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 1997

Filed:

Jun. 07, 1995
Applicant:
Inventors:

Jack G Winterowd, Puyallup, WA (US);

Harvey H Cox, Seattle, WA (US);

Roland E Kreibich, Auburn, WA (US);

Stanley L Floyd, Enumclaw, WA (US);

Hans Gross, Auburn, WA (US);

Assignee:

Weyerhaeuser Company, Federal Way, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
1563045 ; 156310 ; 156335 ; 428 58 ; 428525 ; 428529 ; 525501 ; 525504 ;
Abstract

A rapid curing adhesive for wood finger jointing and laminating and a method of its use are disclosed. The adhesive consists of two parts that are used as a honeymoon system. One part is used on one side of the joint being formed and the other part on the other side. When the parts are joined under pressure a very rapid reaction occurs resulting in a durable weather resistant joint. Wood finger joints bonded with the adhesive can be handled for further processing within as little time as 15 seconds. The first part of the adhesive is a conventional resorcinol-formaldehyde or phenol-resorcinol formaldehyde resin containing a hardener such as an alkylene group donor. The second part is a similar resin lacking any hardener but containing a modifier which is a heterocyclic oxygen and nitrogen containing compound. Morpholine has proved to serve well as the modifier. The hardener in the first part is used in a sufficient amount to effect a thermosetting cure for the resin used in both parts. Despite the rapid reaction when the two parts are combined, the adhesive has a significant closed assembly time tolerance before application of full pressure to the joint.


Find Patent Forward Citations

Winterowd, Jack. (1997). Rapid setting adhesive and method of its use (U.S. Patent No. 5626705). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5626705

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…