The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 1997
Filed:
Aug. 18, 1995
Applicant:
Inventor:
Yasuo Kawada, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ;
U.S. Cl.
CPC ...
228 41 ; 228246 ;
Abstract
A solder-ball mounting apparatus is provided with a ball feed jig having a ball tank that may receive a predetermined number of solder-balls for feeding the solder-balls to a ball suction jig through a guide mask mounted on an opening portion of the ball tank, and blowout holes formed in a bottom of the ball tank for a blow gas as a blow unit for agitating the solder-balls received in the ball tank in the ball feed jig. The solder-balls may be positively sucked to ball suction holes one by one without turning over the ball suction jig.
Quick Actions:
Kawada, Yasuo. (1997). Mounting apparatus of solder-balls (U.S. Patent No. 5626277). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5626277
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile