The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 1997
Filed:
Oct. 03, 1995
Applicant:
Inventors:
Masayasu Kojima, Takarazuka, JP;
Chihiro Hayashi, Takarazuka, JP;
Tetsuo Abiko, Nara, JP;
Keiji Miki, Amagasaki, JP;
Assignees:
Sumitomo Metal Industries, Ltd., Osaka, JP;
Sumitomo Precision Products, Co., Ltd., Amagasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257712 ; 257722 ; 361697 ; 361709 ; 361717 ;
Abstract
A heat sink fin assembly of the corrugated type for cooling an LSI package comprises a flat base plate and a heat dissipating member made of a thin metal sheet having convex and concave portions which are comprised of a repeated series of side wall portions, top portions, and bottom portions. The base plate and the heat dissipating member are integrated with each other by bonding.
Kojima, Masayasu. (1997). Heat sink fin assembly for cooling an lsi package (U.S. Patent No. 5625229). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5625229
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile