The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 1997
Filed:
Apr. 19, 1995
Applicant:
Inventors:
Miho Yamaguchi, Osaka, JP;
Mitsuyoshi Shirai, Osaka, JP;
Yoshitada Morikawa, Osaka, JP;
Yoshiaki Mitsuoka, Osaka, JP;
Michio Komoto, Osaka, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ; C08L / ; H01L / ;
U.S. Cl.
CPC ...
524405 ; 524413 ; 524431 ; 524434 ; 524435 ; 524437 ; 523442 ; 523445 ; 437243 ; 438127 ; 257792 ; 257793 ;
Abstract
A semiconductor device obtained by encapsulating a semiconductor element with a thermosetting resin composition comprising a thermosetting resin (Component I) and a hardener (Component II) having the following components III and IV incorporated therein. The semiconductor device is thus provided with a high heat resistance at infrared reflow step and a high flame retardance, showing a drastically enhanced reliability. (III) A metal hydroxide represented by the following general formula (1):