The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 1997

Filed:

May. 11, 1995
Applicant:
Inventors:

Keiichiro Hayakawa, Yokohama, JP;

Jerome D Smith, Cary, NC (US);

Hidehiro Yamada, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F / ;
U.S. Cl.
CPC ...
430198 ; 430315 ; 430330 ; 427 58 ; 427102 ; 4271261 ; 432 13 ;
Abstract

To provide a method of manufacturing thick-film resistor elements that forms thick-film resistors having a uniform thickness on a substrate surface with high precision. A method of manufacturing thick-film resistor elements by applying a thick-film resistor composition, obtained by dispersing a conductive component and an inorganic binder in an organic medium and which has a specified rheology, through a clear relief image obtained by exposing, curing, and developing a resist layer of a photopolymerizable mixture formed on an insulating substrate according to the resist pattern, and the thick-film paste obtained at this time has almost the same thickness as the photopolymerizable layer on the surface of the insulating substrate and is patterned according to the high-precision pattern defined by the sharp, linear, lateral edge enclosed by the resist image removed by development.


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