The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 1997
Filed:
May. 25, 1995
Jose A Martinez, Garden Grove, CA (US);
Louis E Gates, Jr, Westlake Village, CA (US);
Hughes Electronics, Los Angeles, CA (US);
Abstract
A heater assembly and a method for securing and removing an object, such as a ceramic package to and from a surface, such as the surface of circuit module or printed wiring board, for example. The heater assembly includes a heater element such as a foil (film or wire) element, embedded or sandwiched between two layers of adhesive, such as thermoplastic adhesive. The layers of adhesive may contain a dielectric filler material with relatively high thermal conductivity to enhance heat transfer capabilities through the heater assembly. Two heater electrodes protrude from the heater assembly and are not encapsulated by the layers of adhesive and are accessible so that voltage may be applied to the heater element. During use, the heater assembly is disposed between the base of the object and the surface to which it is to be secured. A predetermined low voltage is applied to exposed heater electrodes to activate the heater element, whereupon heat generated by the heater element softens the layers of adhesive. When the voltage is removed, the layers of adhesive solidify and bond the object firmly to the surface. When bonding a ceramic package to a circuit board, for example, the use of layers of adhesive containing dielectric filler material having a relatively high thermal conductivity enhances heat transfer from the package to the circuit board, or to a heat sink upon which it typically mounted. If the object needs to be removed for repair or replacement, voltage is reapplied to the heater electrodes, whereupon the layers of adhesive soften and the object is removed.