The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 1997
Filed:
Mar. 24, 1994
Takushi Motoyama, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A multichip substrate including a bonding pad, wiring layers insulated by polyimide layers and structure for protecting separation or the polyimide layers from occurring due to water oozing from the polyimide layers by: fabricating posts between the bonding pad and an inorganic insulation layer fabricated on a base substrate through the organic insulation layers by accumulating parts of the wiring layers; and providing holes for setting the water free, around the bonding pad so that the polyimide layer is exposed out of the multichip substrate; or fabricating the bonding pad directly on the inorganic insulation layer, fabricating the polyimide layers and wiring layers in terraced configuration at a periphery of the bonding pad.