The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 1997
Filed:
Jun. 05, 1996
Applicant:
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Suwon, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257666 ; 257673 ; 257669 ; 257676 ; 257688 ; 257735 ;
Abstract
A thin semiconductor package having a support film formed on an upper surface of the inner leads with a thickness approximately equal to the thickness of a portion of the molding compound overlaying the inner leads.
Mok, Seung-Kon. (1997). Semiconductor package having support film formed on inner leads (U.S. Patent No. 5621242). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5621242
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile