The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 15, 1997

Filed:

Aug. 22, 1995
Applicant:
Inventors:

Tamotsu Kawai, Settsu, JP;

Kinzo Masuda, Ibaraki, JP;

Masao Ando, Toyonaka, JP;

Fukuzo Imada, Kashihara, JP;

Masahiro Chikada, Settsu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D / ;
U.S. Cl.
CPC ...
264 454 ; 264 455 ; 264 456 ; 4283186 ; 4283188 ; 4283199 ;
Abstract

A foam molded product of a synthetic resin having a continuous hardened surface layer formed uniformly on a part or the whole of its surface during its foam-in-place molding and having a desired thickness. A mold and a process which can make such a product without bringing about any substantial change in an ordinary foam-molding operation. A part of foamable resin particles which are fed into the mold for making the product are caused to contact a mold surface heated to or above the melting point of the particles and melt to form a molten resin layer, and the molten resin layer is hardened to form the hardened surface layer.


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