Apparatus for fluid delivery in chemical vapor deposition systems

Abstract

Described herein is an apparatus and method for delivering fluid components for semiconductor processes such as chemical vapor deposition (CVD) and chemical etch processes. Any prescribed mixture of separate fluid reagents can be delivered with extreme accuracy and precision using the apparatus we describe here. The unique embodiment of a precision fluid pumping system utilizing internal pressure and temperature transducers, capacity volume and restrictive elements that comprise a continuous pulse-free system for use in CVD applications. This system has superior performance characteristics in the areas of: accuracy, precision, repeatability of the fluid mixture delivery and continuous repeatable delivery without intermittent pulsation. We describe a novel fluid pump whose design is integrated using a closed loop feedback system composed of temperature and pressure sensors. This allows the entire system to perform to in either an isobaric-isothermal mode or an isocratic-isothermal mode. The construction of this system is separated into three principle areas (Fluid Pump Hardware), (Fluid phase change hardware) and (Control algorithms), the complete embodiment constitutes a novel invention in the field of chemical delivery as pertaining to the fabrication of semiconductor devices.