The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 1997
Filed:
Jul. 11, 1995
Friedrich Schneider, Weissach, DE;
Wolfgang Worz, Illingen, DE;
Werner & Pfleiderer GmbH, Stuttgart, DE;
Abstract
A die plate for the underwater granulation of thermoplastic material is formed with a base plate of an iron alloy, a hard annular cutting plate of titanium-carbide alloy, and an intermediate buffer layer containing nickel between the base plate and the cutting plate to equilibrate heat stresses due to different coefficient of thermal expansion of the base and the cutting plates. The intermediate layer is formed with a thickness of between 0.5 and 2 mm by hot-isostatic pressing a nickel-containing metal powder between the plates such that the intermediate layer is diffusion welded to the plates. Two nickel layers with an intermediate titanium-containing plate can also be formed. Also an ansenitic layer can be formed between the nickel layer and the base plate.