The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 1997

Filed:

Aug. 01, 1995
Applicant:
Inventors:

Kiyotaka Okazaki, Shizuoka, JP;

Masahiro Kanda, Shizuoka, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ;
U.S. Cl.
CPC ...
524731 ; 524789 ; 524861 ; 524862 ; 528 15 ; 528 21 ; 528 23 ;
Abstract

The present invention provides a sealing component for connector waterproofing having an excellent heat resistance, low-temperature resistance and oil resistance which can be economically produced in a reduced molding time. A novel sealing component for connector waterproofing is provided, which comprises a vulcanized composition comprising at least (a) 100 parts by weight of an organopolysiloxane represented by the following average composition formula (I) containing at least two alkenyl groups per molecule and having a viscosity of at least 100,000 cs, (b) from 0.1 to 20 parts by weight of an organohydrogenpolysiloxane represented by the following average composition formula (II) containing at least two hydrogen atoms directly bonded to silicon atom per molecule, (c) from 5 to 500 parts by weight of a finely divided silica filler, (d) the catalytic amount of a platinum catalyst, (e) from 0.005 to 5 parts by weight of a sulfide compound represented by the following general formula (III), and (f) from 0.005 to 5 parts by weight of a triazine compound represented by the following general formula (IV), the formulas (I), (II), (III) and (IV) being as described herein.


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