The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 1997
Filed:
May. 31, 1995
Applicant:
Inventor:
Robert M Boysel, Plano, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438464 ; 83 84 ;
Abstract
A method of immobilizing both (i) a semiconductor wafer (16) during the sawing thereof to form individual chips (18) and (ii) the resulting chips (18) as and after sawing of the wafer (16) is completed. A negative pressure is applied to the wafer (16) through a wafer carrier (12) to immobilize the wafer and individual chips. The negative pressure is applied to the wafer via ports (30) in alignment with the location of each chip (18) to be formed. A grid (40) or negative pressure is used to restrain the chips as they are subsequently transported following sawing.