Wideband solderless right-angle rf interconnect

Abstract

A solderless right-angle interconnect is provided for achieving flexible, low-profile and enhanced performance high frequency signal interconnections. The interconnect includes a compressible conductive pin assembly which has a first end electrically coupled to a first transmission path and a second end electrically coupled to a stripline circuit trace which provides a second transmission path. According to one embodiment, a springy compressible conductive button is located in a recessed chamber at the second end of the conductive pin and partially extends from the end thereof. According to another embodiment, a springy conductive bellows is formed intermediate the first and second ends of the pin assembly. The second end of the conductive pin further includes at least one tapered edge. A conductive ground layer is further provided for substantially enclosing the interconnect and providing a ground reference thereabout. In a first embodiment, the conductor forming the first transmission path includes a coaxial cable coupled to the conductive pin. In a second embodiment, the first transmission path may include a second stripline circuit trace, in which the first end of said conductive pin assembly likewise includes a least one tapered edge.