The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 1997

Filed:

Sep. 22, 1995
Applicant:
Inventors:

Nagon Takita, Tokyo, JP;

Yasuo Yamamoto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41M / ;
U.S. Cl.
CPC ...
101129 ; 1011284 ;
Abstract

A process for perforating a stencil sheet comprising a thermoplastic resin film is disclosed which process comprises melting predetermined portions of the thermoplastic resin film with the heat from heat-generating elements to form perforations while applying a pressure to the film and under such a condition that the film is spaced away from the heat-generating elements by a close distance. According to the process of the invention, perforations through which ink passes smoothly can be formed in a stencil sheet using a thermal head and thus clear images can be obtained.


Find Patent Forward Citations

Takita, Nagon. (1997). Process for perforating stencil printing sheet (U.S. Patent No. 5617787). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5617787

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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