The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 1997
Filed:
Apr. 26, 1996
Takashi Nakano, Tokyo, JP;
Yukio Taniji, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
It is the object of the invention to expand a band width of an amplifier by effectively decreasing wiring capacitances of the amplifier formed in a semiconductor chip. The semiconductor chip is implemented in a package, and an output signal of the amplifier (not shown) formed in the semiconductor chip is supplied to the input terminal of an external buffer amplifier. In various signal paths which connect the output amplifier to the buffer amplifier, a signal wire, which connects the output terminal of the output amplifier to an output pad formed in the circumference of the chip, is provided with a shield wire thereunder. The shield wire is supplied with the output signal of the buffer amplifier. Since the phase and the amplitude of the voltage supplied by the buffer amplifier is nearly the same as those of the signal wire, the wiring capacitance between both wires is equivalently zero.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile