The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 1997

Filed:

Jul. 26, 1995
Applicant:
Inventors:

Kazuhiro Noda, Chikushino, JP;

Siniti Nakazato, Fukuoka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ;
U.S. Cl.
CPC ...
228103 ; 228 41 ; 228 565 ; 228246 ;
Abstract

In a soldering ball mounting apparatus, a pickup head is movable between a soldering ball feeder and a workpiece to be mounted with soldering balls. The pickup head has a bottom formed with a large number of absorber holes for vacuum-absorbing the soldering balls from the soldering ball feeder. On the way to the workpiece, light is irradiated onto the bottom of the pickup head from the exterior. When the light leaks into the pickup head, the leakage light is detected by a light detector provided in the pickup head so that presence of a soldering-ball pickup error is determined. On the other hand, on the way to the soldering ball feeder after mounting the soldering balls onto the workpiece, light is irradiated along the bottom of the pickup head from one side. Accordingly, when the light is not received at the opposite side, at least one soldering ball remains attached to the bottom of the pickup head so that presence of a soldering-ball mounting error is determined.


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