The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 1997
Filed:
Sep. 29, 1994
Stuart Yoshida, Fort Collins, CO (US);
Rex Seader, Fort Collins, CO (US);
Stephen P Neisen, Fort Collins, CO (US);
Hewlett-Packard Co., Palo Alto, CA (US);
Abstract
An improved heat sink assembly apparatus and method of attachment that includes a heat sink with extruded fins, an integrated circuit package, a printed circuit board and a clamp. The printed circuit board is manufactured with L-shaped holes that correspond to opposing corners of the integrated circuit package and the distance between two notched feet on the clamp. To assemble, the integrated circuit package is mounted to the printed circuit board, the heat sink is mounted to a top surface of the integrated circuit package, the clamp is mounted between extruded fins on the heat sink, and then the feet of the clamp are locked into the L-shaped holes on the printed circuit board.