The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 1997
Filed:
May. 10, 1996
Brent N Sweitzer, Nerstrand, MN (US);
Sheldahl, Inc., Northfield, MN (US);
Abstract
A printed circuit assembly and a method of manufacturing therefor are provided for directly connecting unpackaged integrated circuit chips such as flip chips to a footprint of active contact pads on a printed circuit substrate. A reduction in packaging density is obtained by electrically interconnecting one or more of the active contact pads with circuit traces formed on different layers of the printed circuit substrate. In a preferred embodiment, at least one of the active contact pads includes an electrically conductive through hole electrically connecting the contact pad and a circuit trace located on the back side of a double-sided printed circuit substrate. In another embodiment, the printed circuit substrate is a multilayer construction, which enables active contact pads to be electrically interconnected with circuit traces on a plurality of circuit layers.