The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 1997

Filed:

Aug. 24, 1994
Applicant:
Inventors:

Richard Deeley, San Jose, CA (US);

Carlos Dangelo, Los Gatos, CA (US);

Assignee:

LSI Logic Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02B / ;
U.S. Cl.
CPC ...
364489 ;
Abstract

Signal area efficiency in integrated circuit designs is improved by increasing the information efficiency of signal wiring on an integrated circuit. Candidate signals are selected for combination by prioritizing signals according to length of travel, travel path, and information content. Signals with low information content and with greater distance between endpoints make poor utilization of fixed wiring and provide the best candidates for improvement. Candidate signals which travel similar (substantially parallel) paths from point to point across the integrated circuit are combined to improve chip area utilization efficiency. A variety of techniques are described for combining low-information-content signals onto a small number of wires, transmitting them over the small number of wires, and re-expanding them at their destination. Assuming that the combining/expanding circuitry occupies less space than the point-to-point wiring which would otherwise be required, there is a net reduction in chip area. One aspect of the invention is directed to using auto-routing switching techniques for combining signals. Another aspect is directed to applying these combining/expanding techniques to the integrated circuit design process.


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