The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 1997

Filed:

Dec. 16, 1994
Applicant:
Inventors:

Martin Hudis, Mattapoisett, MA (US);

Mamoru Koebisu, Furutakacho-Moriyamashi, JP;

Kenji Hatada, Shiga, JP;

Assignees:

Aerovox Incorporated, New Bedford, MA (US);

Toray Industries, Inc, , JP;

Toray Plastics America, Inc., North Kingstown, RI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G / ; H01G / ;
U.S. Cl.
CPC ...
361313 ; 3613015 ; 3613063 ; 3613212 ; 361322 ; 361312 ; 361305 ;
Abstract

A film capacitor in which the unmetallized margin is provided with a semiconductive layer. The layer provides a parallel resistive path within the capacitor, itself, obviating the need for an external resistor. It also grades the electric field across the margin, i.e., makes the field more uniform, thus allowing the margin to be made narrower without electrical breakdown, permitting a reduction in the physical size of the capacitor. A refractory, semiconductive layer is provided between the metal layer and the dielectric film. The refractory layer accelerates the self-clearing process, by insulating the underlying dielectric film from the heat generated by the vaporizing metal, thus hastening vaporization and reducing the tendency of the dielectric film to carbonize. As a result, faults are cleared with substantially less energy consumption. Preferably, the refractory layer is also semiconductive, to reduce field emission effects, and thereby decrease the frequency of faults in the dielectric film.


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