The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 1997

Filed:

Mar. 15, 1995
Applicant:
Inventors:

Masahiro Tsumura, Kamisu-machi, JP;

Hiromi Miyasita, Kamisu-machi, JP;

Kaneyoshi Oyama, Kamisu-machi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F / ; C08L / ; C08G / ;
U.S. Cl.
CPC ...
525481 ; 525485 ; 525492 ; 525534 ; 525935 ;
Abstract

A fiber-reinforced resin plate comprising a fibrous base material and a matrix bonding the fibers contained in the fibrous base material, the matrix being formed by curing a resin composition comprising a highly reactive modified phenolic resin (A) prepared by polycondensing a petroleum heavy oil or pitch, a formaldehyde polymer and a phenol in the presence of an acid catalyst to thereby prepare a modified phenolic resin and-reacting the resultant modified phenolic resin with a phenol in the presence of an acid catalyst to thereby lower the molecular weight of the modified phenolic resin, and an epoxy resin (B). Also, a prepreg and a process for producing the fiber-reinforced resin plate. This fiber-reinforced resin plate is excellent not only in adhesion to copper and other metals, heat resistance and electrical insulating properties but also in dimensional stability, strength and other mechanical properties, especially those at heating, because of the formation of the matrix by curing of the above resin composition comprising the highly reactive modified phenolic resin (A) and the epoxy resin (B).


Find Patent Forward Citations

Loading…