The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 1997
Filed:
May. 16, 1995
Jacques De Givry, Les Loges en Josas, FR;
Matra Marconi Space France, Paris, FR;
Abstract
The chip is fixed to a substrate by its lower face. At least one wire-bonding adaptor in the form of a board is used, the upper face of which has first bonding pads along at least one first edge and second bonding pads along at least one second edge, and including electrical connections between the first and second bonding pads. The wire-bonding adaptor is adhesively bonded by its lower face to the upper face of the chip so that the said first edge is adjacent to a row of output pads located elsewhere than on the periphery of the upper face of the chip and so that the said second edge is adjacent to the periphery of the chip. Bonding wires are bonded, on the one hand, between the output pads of the said row and the first bonding pads and, on the other hand, between the second bonding pads and conducting pads on the substrate.