The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 1997

Filed:

Jun. 07, 1995
Applicant:
Inventors:

Toshihiko Kondo, Suwa, JP;

Kazuo Tanaka, Suwa, JP;

Hirofumi Yasuda, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257288 ; 257750 ; 257758 ;
Abstract

A semiconductor device includes a substrate, a first insulating film carried on the substrate, a first conductor layer having sides and carried on the first insulting film, and an interlayer insulating film overlying the first conductor layer and the first insulating film. The interlayer insulating film includes a top portion which overlies the first conductor layer and a pair of sidewall portions which overlie the first insulating film and are adjacent to and in contact with the sides of the first conductor layer. The semiconductor also includes a second conductor layer which extends from overlying part of the top portion of the interlayer insulating film to and in contact with an exposed portion of the substrate and adjacent the first insulating film wherein a portion of the second conductor layer is in contact with a thinned portion of the interlayer insulating film.


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